New Optimization Strategy for Chemical Mechanical Polishing Process.

Layout Optimization with Dummy Features for Chemical - Mechanical Polishing Manufacturability

Acknowledgments The duration of my Ph.D. study in the computer sciences department at the University of Texas at Austin is an interesting period of my life that I will always treasure. People in different circles have touched my life in this period. I wish to thank all of them sincerely from the bottom of my heart. Foremost, on the academic front, I wish to thank my committee members, especiall...

Device independent process control of dielectric chemical mechanical polishing

The use of the chemical-mechanical polishing (CMP) process in the semiconductor industry is growing rapidly, and it is a critical step in the manufacturing of integrated circuits. The CMP process is complicated by many factors, and controlling all of these factors in a single controller has been unrealistic. One of the most significant factors complicating control is the dependency of the polis...

Advanced Process Control in Dielectric Chemical Mechanical Polishing (cmp)

The decrease in device dimensions is placing extremely tight constraints on many aspects of the CMP process. We outline four key areas that will provide significant steps toward attaining this level of control. In particular, we discuss the need for improved in-line surface topography metrology, and show that that high resolution profilometry appears to meet this need. We demonstrate the need f...

Laser Assisted Chemical Mechanical Polishing for Planarization

A Mechanical Model for Erosion in Copper Chemical-mechanical Polishing

The Chemical-mechanical polishing (CMP) process is now widely employed in the ultra-large-scale integrated semiconductor fabrication. Due to the continuous decrease in the sub-micron feature size, characterization of erosion has become an important issue in Cu CMP. In this paper, the erosion in Cu CMP is considered at two levels: wafer and die levels. Erosion models are developed based on the m...